Taiwanese chipmaker MediaTek unveiled today (26) at a brief press conference in Beijing, its new mid-smartphone smartphone chipset, the Dimensity 800.
The company has not given much details about its new chipset, but promises to reveal the specifications and demonstrate the firepower of the Dimensity 800 during CES 2020, which will take place January 7-10, 2020 in the city of Las Vegas.
As a first glance, MediaTek says the Dimensity 800 is coming up against current Kirin 800 and Qualcomm Snapdragon 7xx series processors, and will have a major asset in supporting 5G technology thanks to the integrated Helio M70 5G chip.
Highlight of the Dimensity 800 will be bringing the 5G to intermediate smartphones
Thus, the new MediaTek chipset should reach speeds of 4.7 Gbps for download and 2.5 Gbps for upload, bringing support for SA and NSA networks. The Dimensity 800 will be just the second chipset to feature the Helio M70 5G, and the Dimensity 1000L, unveiled last month, was responsible for introducing the company's 5G chip in the smartphone market.
Score appeared on Weibo; It is speculated that the device tested is a variant of the Redmi K30 Pro 5G
Speaking of the Dimensity 1000, the SoC that marks the return of a MediaTek chip in the high-end segment had the first smartphone equipped with such a processor launched today (26), with the Oppo Reno3. Featuring four 2.6 GHz Cortex-A77 performance cores plus four 2.2 GHz Cortex-A55 power-saving cores, plus a Mali-G77 MP9 GPU, the manufacturer promises to fight the two main processors on the market, Snapdragon 865 and Kirin 990.
Both the Dimensity 800 and Dimensity 1000 / L will be MediaTek's two biggest bets for the smartphone market during 2020, and it promises that the first smartphones that will be equipped with the company's new chipsets will be available to consumers during Q1. 2020
Source: GSMArena, Gizmochina
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